Packaging Development Engineer
CÔNG TY TNHH QORVO VIỆT NAM
5th Floor, CIC Tower - 219 Trung Kinh Street, Cau Giay District, Hanoi
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Mức lương:
Thỏa thuận
Khu vực:
Hà Nội
Chức vụ:
Nhân viên
Hình thức làm việc:
Toàn thời gian
Lĩnh vực:
Khác
Mô tả công việc
ABOUT THE POSITION:
Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.
RESPONSIBILITIES:
• Develop and integrate new semiconductor packaging technologies.
• Manage technical projects for packaging technology advancement.
• Serve as a lead expert in packaging assembly processes, especially SMT.
• Innovate in package design, processes, and materials for next-generation solutions.
• Offer technical guidance during development phases and address high-volume production challenges.
• Spearhead projects from concept through to qualification and production in collaboration with R&D.
• Support technical customer engagements and problem resolution.
• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.
• Collaborate with offshore assembly, substrate partners, and suppliers.
• Present project updates to executive management and contribute to patent creation.
Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.
RESPONSIBILITIES:
• Develop and integrate new semiconductor packaging technologies.
• Manage technical projects for packaging technology advancement.
• Serve as a lead expert in packaging assembly processes, especially SMT.
• Innovate in package design, processes, and materials for next-generation solutions.
• Offer technical guidance during development phases and address high-volume production challenges.
• Spearhead projects from concept through to qualification and production in collaboration with R&D.
• Support technical customer engagements and problem resolution.
• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.
• Collaborate with offshore assembly, substrate partners, and suppliers.
• Present project updates to executive management and contribute to patent creation.
Quyền lợi được hưởng
Competitive salary and bonus
,#Social insurance, health insurance, unemployment insurance according to Labor Laws
,#Good chance to study and develop career path stably
,#Social insurance, health insurance, unemployment insurance according to Labor Laws
,#Good chance to study and develop career path stably
Yêu cầu kỹ năng
Semiconductor Packaging, SMT Process Expertise, Project Management, Package Design, Communication Skills
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